Lapping

Low resistance Ti/Al/Au ohmic backside contacts to nonpolar m-plane n-GaN (Semiconductor technology)

Doping / Annealing / OR / Plasma Etching / Vacancy / Contact Resistance / Inductively Coupled Plasma / Ohmic Contact / Lapping / Polishing / Electrical And Electronic Engineering / Electronics Letters / Contact Resistance / Inductively Coupled Plasma / Ohmic Contact / Lapping / Polishing / Electrical And Electronic Engineering / Electronics Letters